Produkt mají v nabídce:
Introduction to Microsystem Packaging Technology - Jin, Yufeng (Peking University) a Wang, Zhiping a Chen, Jing (Peking University)
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.
