Produkt mají v nabídce:
Thermal Design of Electronic Equipment - Remsburg, Ralph (Opvista, Irvine, California, USA)
Presents the formulas used by electronic packaging and thermal engineers. This book presents heat transfer equations dealing with polyalphaolephin, silicone oils, perfluorocarbons, and silicate ester-based liquids. It presents empirical formulas and practical techniques that lets you solve thermal engineering problem in electronic packaging.
